Technical Information

Special printing

Carbon-conductive ink printing
For carbon-conductive ink printing the type Coats XZ 302-1 MV will be used. Due to the critical copper pattern topography and the related risk of smearing the application of carbon-conductive ink printing is restricted to printed circuit boards with a maximum copper thickness of 40 µ.

Peelable solder resist mask
The peelable solder resist mask we use is the type SD 2955 blue-green made by Lackwerke Peters. The thermal resilience is limited and should be tested by the customer in advance. If thermally overloaded the solder mask takes on a dark colour and can be peeled off in small pieces only. The solder mask requires a certain minimum thermal exposure to achieve a sufficient tensile strength. The layer thickness is approximately 250 µ.

Via hole fillers
The via hole filler we use is the type SD 2361 T made by Lackwerke Peters.

Note:
Detailed information can be found in our functional specification which is available on request.

Note:
More technical details in Design-Rules.