Technical Information

Copper pattern

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The copper pattern is generated by a series of photographic, plating and etching process steps. Changes in the pattern caused by undercutting result in narrower track widths and reduced annular ring geometries. These losses depend on the thickness of the base copper and have to be accepted to a certain extent.

Etching loss
The process-related losses caused by undercutting are constant and depend only on the copper lamination thickness. Except for tracks with a defined impedance these reductions in track width have to be accepted by the customer.

Note:
More technical details in Design-Rules.

Note:
Detailed information can be found in our functional specification which is available on request.