Technische Informationen

Design-Regeln

1.	Conductor width
2.	Conductor spacing
3.	Annular ring
4.	Microvia technology (final diameter through holes ≤ 150 µ) Diameter pad Diameter drilled hole Final diameter
5.	Antipad inner layers
6.	Annular ring thermal resistance
7.	Solder mask haloing
8.	Solder mask web
9.	Layout milling
10.	Layout scoring
11.	Distance drilled hole wall / drilled hole wall
12.	Final diameter drilled hole (through holes)
13.	Aspect Ratio