Technical Information
Hole pattern
In the diameter range from 0.1 to 3.25 mm drills are available in increments of 50 µ and in the range from 3.3 to 6.0 mm in increments of 100 µ. Hole diameters beyond that size are milled and belong to the mill pattern.
Plated-through hole pattern
All datum positions for later use are based on the plated-through hole pattern. Thus, all through holes (both plated-through and non-plated-through) must be drilled in this processing step.| Plated-through holes | Nominal diameter | Diameter tolerance | Positional tolerance in the hole pattern | |
| min. mm | max. mm | µ | µ | |
| Via holes | 0,200 | 0,400 | -50 / +100 | + / -25 |
| Through holes | 0,450 | 3,250 | -0 / +100 | + / -25 |
| 3,300 | 6,000 | -0 / +150 | + / -25 | |
| Holes for press-in mounting *1) | 0,700 | 2,000 | -50 / +90 | + / -25 |
| Microvia holes | <0,150 | -80 / +0 | + / -25 | |
| Buried holes | 0,200 | 0,50 | -150 / +50 | + / -25 |
| Blind holes | 0,125 | 0,60 | -50 / +50 | + / -25 |
| Slots (nibbled, milled) | 0,600 | 3,20 | -50 / +125 | + / -25 |
*1)
Specification for press-in mounting holes:
Final diameter according to standard IEC 352-5 / EN 60352-5: -50 µ / +90 µ
Note:
More technical details in Design-Rules.
Non-plated-through hole pattern in tenting technology
Non-plated-through holes which require a small positional tolerance to plated-through holes are drilled together with these in the same processing step. In a subsequent lamination and photographic process for the plating step these non-plated-through holes will be closed with a tent thus preventing the deposition of copper in the tented holes.
| Non-plated-through holes in tenting technology |
Nominal diameter | Diameter tolerance | |
| min. mm | max. mm | µ | |
| Through holes | 0,350 | 3,250 | +0 /+50 |
| 3,300 | 6,000 | +0 /+100 | |
| Slots (nibbled, milled) | 0,600*20 | 3,200* 8 | +0 / +100 |
Note:
More technical details in Design-Rules.